SKYLENS Chemical Mec計南hanical Polishing Equ長秒ipment

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Product description

Mee場但t all complex planarization p腦湖rocess requirements in IC manufacturin兵視g. Suitable for main開多stream 14nm/28nm logic proce姐物sses, covering STI/ILD/I些書MD, FinFET/Metal gate/W/Cu a一短nd other processes.

Product Features

Layout dimensions (length * wid現區th * height) 5.70m * 2.80m * 2.70m
2×2Polishing table and dual cl一見eaning station
Dual independent processes 對快and transmission systems
The grinding head and grind間術ing table correspond in op鄉校position, ensuring better proces冷章s consistency( WIW & WTW <3%)
The output rate has signific分可antly increased compared to intern金兒ational imported equipm通遠ent WPH >60

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