GEGV

SEMICORE

SINCE 2019

SEMICORE

SINCE 2019

Focus on integrated circuit co問上re equipment CMP

SEMICORE

SINCE 2019

SEMICORE

SINCE 2019

Focus on integrated circuit core什兒 equipment CMP

HJP200 CMP

SEMICORE

HJP200 CMP

SEMICORE

Focus on integrated circuit core eq熱輛uipment CMP

About us

Focus on integrated circuit core eq他國uipment CMP

Focusing on the core CMP core business關金 of integrated circuit core e聽見quipment, focusing on the technol頻土ogies and operating shortcomings t懂紅hat need to be broken in the pr舊志ocess of industrializ微議ation and marketization, cont購對inue to promote the 通務development of CMP equipment劇那 and industrialization, continue to樂司 strengthen capacity building, b廠好uild a business developmen畫新t system, and consolidate the core Comp低媽etitiveness.

Product technologies林和

Focus on the core business of 鐘東integrated circuit core equipment CMP

HJP200 CMP

HJP200 Chemical mechanical 分姐polishing machine

It is mainly used for all flattening pr笑到ocess equipment in wafer chip人照 manufacturing, such as IMD, STI,行到 ILD, BPSG, contactor, metal line, et草月c., while supporting TSV, MEMS and oth報務er new fields of flattening process.

Features

The compact structure上樂 of the whole machine saves the use of船個 purification plant space;
Can realize "dry in and dry ou畫日t" of wafers;
Online endpoint detection mode,自報 real-time process control;
The control software is completely auto用國nomous and controllabl費火e.

200^mm

Wafer size

Polishing heads

Polishing discs

200^rpm

Speed of polishing disc

Skylens

SKYLENS Chemical Mechanical Po去長lishing Equipment

Meet all comple人如x planarization process requirements in黃姐 IC manufacturing. Suitable for mains來地tream 14nm/28nm logic processes, cove朋又ring STI/ILD/IMD, FinFET/Metal gate現友/W/Cu and other proces學腦ses.

Features

Layout dimensions (length * width * hei樂刀ght) 5.70m * 2.80m * 2.70m
2×2Polishing table an事要d dual cleaning station
Dual independent proce錢遠sses and transmission systems
The grinding head and g黃湖rinding table correspond in 和的opposition, ensuring be坐個tter process consiste睡要ncy( WIW & WTW <3%)
The output rate has significantly in對秒creased compared to international imp化長orted equipment WPH >60

Horizon-T

6/8-inch CMP device - Horizon-T

主要用于晶圓芯片制造中(zhōng)所有平坦化工(gōng)長看藝需求的設備，如IMD、STI、ILD、BPSG、黑自contactor、metal line等，同時支持TSV、MEMS等新領域的平坦化工(gōng)藝事謝。

Features

Compatible with 6/8-inch wafers, f請快ully automatic dry in and dr黃好y out, flexible process switching, and微好 wide applicability
Support the flattening p門就rocess requirements of SiC, GaN th去時ird-generation semicondu林歌ctors and special materials
Realize mass sales in China

200^mm

晶圓尺寸

4^個

抛光頭數量

3^個

抛光盤數量

200^rpm

抛光盤轉速

Horizon300

12 inch CMP device - Horizon3器件00

主要用于晶圓芯片制造中(zhōng)所有平坦輛還化工(gōng)藝需求的設備，如IMD、STI、ILD、BPSG、c少工ontactor、metal line等，體數同時支持TSV、MEMS等新領域的平坦化工用劇(gōng)藝。

Features

4-Head & 3-Platen polisher; Ver海是tical wafer clean configuration請報.
Integration of multip草兵le advanced endpoint system and a fully相民 precise process control system醫但.
Meet CMP process requirements for 28n一腦m node and above.
Mature architecture, ev車低ident cost advantage 信內in production line.