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6/8-inch CMP device - Horizon-T
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Product description
- Compatible with 6/8-inch wafers, fully 懂著automatic dry in and dry out兒舞, flexible process switc是報hing, and wide applicabil長可ity
- Support the flattening proce北間ss requirements of S弟風iC, GaN third-generation semiconduct什看ors and special material冷刀s
- Realize mass sales in China
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