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12 inch CMP device - Horizon長厭300
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Product description
- 4-Head & 3-Platen polis嗎舞her; Vertical wafer 做他clean configuration.
- Integration of multi吃小ple advanced endpoint system and 好他a fully precise process control syst吃章em.
- Meet CMP process require對飛ments for 28nm node 都看and above.
- Mature architecture, evident呢微 cost advantage in production line湖路.
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