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發布時間 : 2019-12-27
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Precise control of polishing disc動熱 temperature of CMP 間子polishing machine
- Categories:Company news
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- Time of issue:2019-12-12 17:22
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(Summary description)The CMP process is a pr工小ocess of planarizing the wafer s校花urface. Heat is generated dur行你ing the removal of the wafer開些 surface material, which causes the木化 temperature to rise.
Precise control of polishing disc 水電temperature of CMP polishing ma呢很chine
(Summary description)The CMP process is a process of p拍謝lanarizing the wafer surface. Hea友站t is generated during th我身e removal of the wafer 睡會surface material, which cause雨習s the temperature to rise.
- Categories:Company news
- Author:
- Origin:
- Time of issue:2019-12-12 17:22
- Views:
Information
The CMP process is 少懂a process of planarizing the wa技快fer surface. Heat is gener能的ated during the removal o長子f the wafer surface material, which cau公水ses the temperature to rise. In筆門 order to obtain a uni媽日form polishing removal rate and achie海可ve global planarizatio些空n, it is necessary to The temperature計窗 is precisely controlled. The heat ge通書neration during the CMP 街紅process is analyzed and 靜理analyzed. A method to control the t電動emperature is introduced.
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