CMP-Chemical Mechanical Polishing Tec請紅hnology It uses the "soft朋木-hard" principle of wea司雜r, that is, polishing with s了煙ofter materials to achieve high服校-quality surface polishing. I學那n the presence of a certain pressu區坐re and polishing slurry, the workpi資去ece being polished is relativ北短ely moved relative to the polishing會日 pad. With the organic c老件ombination of the abrasive effec吃作t of the nanoparticles店刀 and the corrosion of the oxidant, a 行窗smooth surface 151 is formed on the 這鄉surface of the workpiec農技e being polished. The most widely used 刀唱CMP technology is the polishing o黃民f silicon wafers, which are substrat議森e materials, in integrated工內 circuits (IC) and ultra-large-sc區科ale integrated circuits (ULSI).